<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:media="http://search.yahoo.com/mrss/" xmlns:content="http://purl.org/rss/1.0/modules/content/" version="2.0">
  <channel>
    <title>Aaj TV English News - Business &amp; Economy</title>
    <link>https://english.aaj.tv/</link>
    <description>Aaj TV English</description>
    <language>en-Us</language>
    <copyright>Copyright 2026</copyright>
    <pubDate>Thu, 09 Apr 2026 15:29:56 +0500</pubDate>
    <lastBuildDate>Thu, 09 Apr 2026 15:29:56 +0500</lastBuildDate>
    <ttl>60</ttl>
    <item xmlns:default="http://purl.org/rss/1.0/modules/content/">
      <title>Japan to add $2.3 billion subsidy to Rapidus for Chitose chip plant, media report</title>
      <link>https://english.aaj.tv/news/30317656/japan-to-add-23-billion-subsidy-to-rapidus-for-chitose-chip-plant-media-report</link>
      <description>&lt;p&gt;&lt;strong&gt;TOKYO:  Japan’s industry ministry is finalising a plan to provide state-backed chip maker Rapidus an additional 300 billion yen ($2.27 billion) in funding to build a semiconductor plant in the northern island of Hokkaido, a local paper reported on Saturday.&lt;/strong&gt;&lt;/p&gt;
&lt;p&gt;Rapidus, which in February picked Chitose, near Sapporo, as the site for a cutting-edge two-nanometre chip factory, previously secured an initial 70 billion yen funding from the government.&lt;/p&gt;
&lt;p&gt;The additional grant will be used to help Rapidus build a prototype line scheduled to launch in 2025, the Hokkaido Shimbun paper said, citing multiple unidentified sources.&lt;/p&gt;
&lt;p&gt;Rapidus chair Tetsuro Higashi told Reuters in February that it would need about 7 trillion yen of mostly taxpayer money to begin mass-producing advanced logic chips in around 2027, with support from American chip giant IBM Corp (IBM.N).&lt;/p&gt;
&lt;p&gt;The Japanese government is also offering up to 476 billion yen in subsidies to a Taiwan Semiconductor Manufacturing Co (TSMC) (2330.TW) plant in Kyushu, in which Sony Group Corp (6758.T) and Denso Corp (6902.T) each have a minority stake&lt;/p&gt;
</description>
      <content:encoded xmlns="http://purl.org/rss/1.0/modules/content/"><![CDATA[<p><strong>TOKYO:  Japan’s industry ministry is finalising a plan to provide state-backed chip maker Rapidus an additional 300 billion yen ($2.27 billion) in funding to build a semiconductor plant in the northern island of Hokkaido, a local paper reported on Saturday.</strong></p>
<p>Rapidus, which in February picked Chitose, near Sapporo, as the site for a cutting-edge two-nanometre chip factory, previously secured an initial 70 billion yen funding from the government.</p>
<p>The additional grant will be used to help Rapidus build a prototype line scheduled to launch in 2025, the Hokkaido Shimbun paper said, citing multiple unidentified sources.</p>
<p>Rapidus chair Tetsuro Higashi told Reuters in February that it would need about 7 trillion yen of mostly taxpayer money to begin mass-producing advanced logic chips in around 2027, with support from American chip giant IBM Corp (IBM.N).</p>
<p>The Japanese government is also offering up to 476 billion yen in subsidies to a Taiwan Semiconductor Manufacturing Co (TSMC) (2330.TW) plant in Kyushu, in which Sony Group Corp (6758.T) and Denso Corp (6902.T) each have a minority stake</p>
]]></content:encoded>
      <category>Business &amp; Economy</category>
      <guid>https://english.aaj.tv/news/30317656</guid>
      <pubDate>Mon, 10 Apr 2023 14:20:48 +0500</pubDate>
      <author>none@none.com (Reuters)</author>
      <media:content url="https://i.aaj.tv/large/2023/04/10141753da5ee32.jpg?r=142048" type="image/jpeg" medium="image" height="480" width="800">
        <media:thumbnail url="https://i.aaj.tv/thumbnail/2023/04/10141753da5ee32.jpg?r=142048"/>
        <media:title>The logo of Rapidus Corp. is displayed at the company headquarters in Tokyo, Japan February 2, 2023. REUTERS
</media:title>
      </media:content>
    </item>
  </channel>
</rss>
